Esko continues to support future generations of packaging workforce with ESEPAC collaboration - Esko

Esko continues to support future generations of packaging workforce with ESEPAC collaboration

New Virtual Reality Room at leading packaging training institute in France uses latest Esko solutions

ESEPAC-logo ESEPAC-student

Packaging engineering students from across Europe will continue to benefit from the latest technology in their studies, after Esko again underlined its commitment to supporting future generations of packaging industry workers.

For many years, students at ESEPAC (Ecole Supérieure Européenne de Packaging) have used Esko solutions as part of their training, with everything from ArtiosCAD packaging design tools and innovative 3D Store Visualizer being donated to the school by the global developer of integrated software and hardware solutions for the packaging sector.

Now, students at the St Germain Laprade-based school are set to benefit from a newly installed 3D Virtual Reality room, again using state-of-the-art solutions supplied by Esko.

Françoise Coudert, Esko Solutions Architect, said providing the latest software and the associated user licenses will ensure that the packaging students benefit from the latest, state-of-the-art solutions from Esko, giving them first-hand experience of the technology they will be using in the ‘real world’ after completing their studies.

“I am proud to be associated with the school, and to work directly with the students to deliver training on the packaging workflow,” she said. “As the future of the industry will inevitably involve further digitization, automation and connectivity, Esko believes it is crucial that the workforce of tomorrow is as skilled and knowledgeable as possible before they embark on their career.

“We constantly invest in developing new digital technology to simplify and streamline the packaging design and production process, and as a company we feel is just as important to invest in those who represent the future of our industry. We have supported training institutions across the world in this way for a number of years now, and we are delighted to again continue that support with this latest collaboration with ESEPAC.”


ESEPAC will celebrate its 30th anniversary next month, and the new 3D Virtual Reality Room will be showcased to guests from across the industry at the special event.

The packaging world is constantly evolving, and in recent years there has been an incredible acceleration in distribution channels, in digital technology applied to packaging, and in advanced digital design tools,” said Serge German, Directeur of ESEPAC. “Esko has become a partner to support us in these developments and to help deliver the necessary skills on digital tools and opportunities to our students.“

“We are proud and happy that Esko, as a leading company in these technologies, is interested in ESEPAC and that it is making available its knowledge and resources to students who will soon join companies that use or produce packaging,” he said. “We hope that in the future this partnership will strengthen and grow, offering our students the best opportunities for their future professions.”

Isabelle Manche, Directrice Générale France & Benelux with Esko, said the company was pleased to be working with ESEPAC. “As technological advances lead to changes within the sector, we believe it’s vitally important that the industry supports the education and training of young people as we drive to both address skills shortages and also develop and inspire the packaging experts of the future,” she said.

“Our work with ESEPAC and commitment to the students ensures that the new generation of packaging workers are familiar with all these latest Esko solutions that are utilized around the world to manage packaging and print processes, enabling them to be truly ready for work and have the skills required to enter the sector.”

The ESEPAC 30th anniversary celebration will be held on 22 October.
To find out more about Esko technology solutions, please visit
For more on ESEPAC, visit

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